This project involved designing a custom Raspberry Pi 4 enclosure to manage heat efficiently and maintain structural integrity using thermal CFD analysis and 3D printing. The goal was to optimize performance and create a compact, aesthetically pleasing design. Source files are available on GrabCAD.

High Level Workflow

Design Process

Using SolidWorks, I designed a custom enclosure for the Raspberry Pi 4, utilizing dimension data from the Raspberry Pi website. The design features a dual-tone, chamfered box in a two-part assembly: a base and a cover. Key design elements include:

• Active Cooling: A 30mm fan integrated into the cover for efficient heat dissipation.

• Secure Assembly: Screws hold the parts together for structural stability.

• Rubber Pads: The base has designated spaces for rubber pads, ensuring grip on surfaces.

• Aesthetic and Practical: Designed to be visually appealing while remaining 3D printer-friendly.

CFD Analysis

To assess thermal performance, I used SolidWorks' internal flow simulation. The following parameters were defined to simulate real-world conditions:

• Heat Sources: The CPU and RAM were modeled as the primary heat sources, based on typical power dissipation.

• Inlet/Outlet Configurations: The fan served as the inlet, with ventilation areas acting as outlets.

• Ambient Temperature: 25°C was set to represent standard room conditions.

• Fan Rotation Speed: The fan was set to 3000 RPM for cooling during high-performance tasks.

• Boundary Conditions: Defined to simulate accurate airflow and heat transfer within the enclosure.

A mesh was generated for solving the CFD case, providing insight into airflow and thermal dissipation patterns.

Results were visualized using cross-sectional views, stream vectors, and glyphs to demonstrate airflow behavior on a von Mises scale.

Conclusion and Results Visualization

The comparative thermal analysis highlights the substantial cooling benefit provided by the fan:

• Fan Off: Without the fan, the Pi reached 81°C, with significant heat buildup near the processor.

• Fan On: With the fan, temperatures dropped to 65°C, and airflow was effectively managed, preventing heat concentration.

Final Steps: 3D Printing

After completing the design and CFD analysis, I uploaded the enclosure files to GrabCAD. A Swedish national accessed the files and 3D printed the model. The results were flawless, with a perfect fit for all parts. Later, I purchased my own 3D printer and successfully printed the enclosure myself, confirming the design's accuracy and functionality.

In action

This video showcases the final assembly of the Raspberry Pi 4 enclosure, offering insights into its thermal performance, CFD analysis findings, and heat dissipation effectiveness.